congatec Thermal Management

Types of Thermal Management
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Qty. RoHS
JUMPtec Heat Sinks HSP COMe-bSL6 Cu-core threaded
Product Comments
47In Stock
Min.: 1
Mult.: 1


congatec CPU & Chip Coolers Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
Datasheet
8In Stock
5On Order
Min.: 1
Mult.: 1

congatec Heat Sinks Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
Datasheet
87In Stock
Min.: 1
Mult.: 1



congatec Heat Sinks Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
Datasheet
8In Stock
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mAL10 E2 through
Product Comments
55In Stock
Min.: 1
Mult.: 1
congatec Heat Sinks * Passive cooling for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
Datasheet
91In Stock
31On Order
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mAL10 E2 slim thread
Product Comments
64In Stock
Min.: 1
Mult.: 1
congatec HPC/sILH-CSA-HP-T
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
Datasheet
1In Stock
Min.: 1
Mult.: 1
JUMPtec CPU & Chip Coolers COMe Active Uni Cooler (w/o HSP)
Datasheet
Product Comments
43In Stock
Min.: 1
Mult.: 1
congatec Heat Sinks Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0 154In Stock
Min.: 1
Mult.: 1

congatec CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
Datasheet
2In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
Datasheet
15In Stock
More Info Available
Min.: 1
Mult.: 1

congatec CPU & Chip Coolers * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
Datasheet
2In Stock
Min.: 1
Mult.: 1

congatec HPC/cALP-HSP-HP-B
congatec Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. 12In Stock
Min.: 1
Mult.: 1
congatec CPU & Chip Coolers Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread
Datasheet
11In Stock
Min.: 1
Mult.: 1

congatec CPU & Chip Coolers Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.
Datasheet
5In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
Datasheet
2In Stock
Min.: 1
Mult.: 1

JUMPtec Heat Sinks HSP COMe-mBT10 thread
Product Comments
19In Stock
Min.: 1
Mult.: 1
JUMPtec Heat Sinks HSP COMe-mAL10 E2 slim through
Product Comments
5In Stock
Min.: 1
Mult.: 1
congatec Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm
Datasheet
24In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded
Datasheet
36In Stock
Min.: 1
Mult.: 1

JUMPtec CPU & Chip Coolers HSK COMe-Basic passive (w/o HSP)
Datasheet
Product Comments
7In Stock
7On Order
Min.: 1
Mult.: 1
congatec Heat Sinks * Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.
Datasheet
3In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded
Datasheet
15In Stock
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.
Datasheet
1In Stock
Min.: 1
Mult.: 1