2400 Memory ICs

Results: 109
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 Mfr.
Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product Type
Mounting Style
Package/Case
Memory Size
Interface Type
ADLINK Technology DDR4 2400 ECC 260P 4GB
ADLINK Technology Memory Modules DDR4-2400, 4GB, 512Mx72, SO-DIMM 260P, 1.2V, Rank:1, CL17, ECC, OP Temp:0 85, Fix Die:No, Samsung Chip(512Mx8) Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 4 GB
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT TSOP-II-86 128 Mbit
ADLINK Technology DDR4 2400 260P 8GB SODIMM 2Rx16
ADLINK Technology Memory Modules DDR4-2400, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, Non-ECC, OP Temp:0 85, Fix Die:No, Samsung Chip(512Mx8) Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 8 GB
ADLINK Technology DDR4 2400 ECC 260P 16GB
ADLINK Technology Memory Modules DDR4-2400, 16GB, 2Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL17, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8) Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 16 GB
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked
Min.: 2.500
Mult.: 2.500
Reel: 2.500

DRAM SMD/SMT BGA-90 128 Mbit
ADLINK Technology DDR4 2400 288P 16GB ECC DIMM
ADLINK Technology Memory Modules DDR4-2666, 32GB, 4Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL19, ECC, OP Temp:0-85, Samsung Fix Die:No, Chip(2Gx8) Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 32 GB
ADLINK Technology DDR4 2400 260P 16GB non-ECC SODIMM
ADLINK Technology Memory Modules DDR4-2400, 16GB, 2048Mx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, non-ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1024M x8*16 ) height:30mm Non-Stocked Lead-Time 13 Weeks
Min.: 1
Mult.: 1
Memory Modules 16 GB
ISSI IS43LR32400G-6BLI-TR
ISSI DRAM 128M, 1.8V, Mobile DDR, 4Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

DRAM SMD/SMT BGA-90
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked
Min.: 2.500
Mult.: 2.500
Reel: 2.500

DRAM SMD/SMT BGA-90 128 Mbit
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 86 pin TSOP II (400 mil) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.500
Mult.: 1.500
Reel: 1.500

DRAM SMD/SMT TSOP-II-86 128 Mbit
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 86 pin TSOP II (400 mil) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.500
Mult.: 1.500
Reel: 1.500

DRAM SMD/SMT TSOP-II-86 128 Mbit
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked
Min.: 2.500
Mult.: 2.500
Reel: 2.500

DRAM SMD/SMT BGA-90 128 Mbit
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked
Min.: 240
Mult.: 240

DRAM SMD/SMT BGA-90 128 Mbit
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 86 pin TSOP II (400 mil) RoHS, T&R
Datasheet
Non-Stocked
Min.: 1.500
Mult.: 1.500
Reel: 1.500

DRAM SMD/SMT TSOP-II-86 128 Mbit
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 86 pin TSOP II (400 mil) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.500
Mult.: 1.500
Reel: 1.500

DRAM SMD/SMT TSOP-II-86 128 Mbit
ADLINK Technology DDR4 2400 260P 4GB non-ECC SODIMM
ADLINK Technology Memory Modules DDR4-2400, 4GB, 512x64, SO-DIMM 260P, 1.2V, Rank:1, CL17, non-ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(512M x16*4 ) height:30mm Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 4 GB
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

DRAM SMD/SMT TSOP-II-86 128 Mbit
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 240
Mult.: 240

DRAM SMD/SMT TSOP-II-86 128 Mbit
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 240
Mult.: 240

DRAM SMD/SMT TSOP-II-86 128 Mbit
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked
Min.: 240
Mult.: 240

DRAM SMD/SMT BGA-90 128 Mbit
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked
Min.: 2.500
Mult.: 2.500
Reel: 2.500

DRAM SMD/SMT BGA-90 128 Mbit
ADLINK Technology DDR4 2400 260P 4GB SODIMM 1Rx8
ADLINK Technology Memory Modules DDR4-2400, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL17, Non-ECC, OP Temp:0 85, Fix Die:No(F-die), Samsung Chip(512Mx8) Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 4 GB
ISSI DRAM Automotive (-40 to +85C), 128M, 3.3V, SDRAM, 4Mx32, 143MHz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.500
Mult.: 2.500
Reel: 2.500

DRAM SMD/SMT TSOP-II-86 128 Mbit
ADLINK Technology DDR4 2400 260P 8GB NON-ECC SODIMM INDUS
ADLINK Technology Memory Modules DDR4-2400, 8GB, 1024Mx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, non-ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(512M x8*16 ) height:30mm Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 8 GB
ADLINK Technology DDR4 2400 260P 16GB NON ECCSO DIMM
ADLINK Technology Memory Modules DDR4-2400, 16GB, 2Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, Non-ECC, OP Temp:-40-85, Fix Die:No, Chip(1Gx8), with comformal coating Non-Stocked
Min.: 1
Mult.: 1
Memory Modules 16 GB