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CSD95490Q5MC

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See Product Specifications

Mouser No:

595-CSD95490Q5MC

Mfr. No:

CSD95490Q5MC

Mfr.:

Texas Instruments

Description:

Switching Controllers 75A SynchEvalMod Buc k NexFET A 595-CSD9

Lifecycle:

NRND:

Not recommended for new designs.

Datasheet:

CSD95490Q5MC Datasheet

ECAD Model:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Texas Instruments
Product Category:	Switching Controllers
Delivery Restrictions:	Mouser does not presently sell this product in your region.
RoHS:
REACH - SVHC:
Topology:	Buck
Number of Outputs:	1 Output
Switching Frequency:	1.25 MHz
Duty Cycle - Max:	85 %
Output Voltage:	5.5 V
Output Current:	75 A
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 150 C
Mounting Style:	SMD/SMT
Package/Case:	VSON-CLIP-12
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Brand:	Texas Instruments
Country of Assembly:	TH
Country of Diffusion:	CN
Country of Origin:	TH
Isolation:	Non-Isolated
Moisture Sensitive:	Yes
Operating Supply Voltage:	4.5 V to 16 V
Product:	Synchronous Buck Converters
Product Type:	Switching Controllers
Series:	CSD95490Q5MC
Shutdown:	Shutdown
Factory Pack Quantity:	2500
Subcategory:	PMIC - Power Management ICs
Tradename:	NexFET
Unit Weight:	129,800 mg

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Datasheet

CSD95490Q5MC Datasheet

Application Notes

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CNHTS:: 8542399000
CAHTS:: 8542390000
USHTS:: 8542310030
MXHTS:: 8542399901
ECCN:: EAR99

Synchronous Buck NexFET™ Smart Power Stage

Texas Instruments Synchronous Buck NexFET™ Smart Power Stage in an industry-standard footprint has a highly optimised design for operating in a high-power, high-density synchronous buck converter. In completing the power stage switching function, the device integrates the driver IC and power MOSFETs. These characteristics achieve high-current, high-efficiency, and high-speed switching capability in a small outline package. Improving accuracy and simplifying system design, the Buck NexFET™ Smart Power Stage integrates accurate current sensing and temperature sensing functionality. The completion of the overall system design is simplified and there is a reduction in the design time due to the optimisation of the PCB footprint.
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