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1374030

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See Product Specifications

Mouser No:

651-1374030

Mfr. No:

1374030

Mfr.:

Phoenix Contact

Description:

Board to Board & Mezzanine Connectors FR 1,27/ 26-FV 6,25

Datasheet:

1374030 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Phoenix Contact 1374030

Delivery Restriction:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Phoenix Contact
Product Category:	Board to Board & Mezzanine Connectors
Delivery Restriction:	Mouser does not presently sell this product in your region.
Product:	Sockets
Number of Positions:	26 Position
Pitch:	1.27 mm (0.05 in)
Number of Rows:	2 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Current Rating:	2.2 A
Maximum Data Rate:	28 Gbps
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	FR
Application:	Monitoring/Security
Brand:	Phoenix Contact
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Insulation Resistance:	5 GOhms
Mounting Style:	SMD/SMT
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	280
Subcategory:	Board to Board & Mezzanine Connectors

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Datasheet

1374030 Datasheet (PDF)

Models

1374030 Symbol & Footprint by SnapMagic

TARIC:: 8536693000
CNHTS:: 8536901100
USHTS:: 8536694040
ECCN:: EAR99

FR 1,27 Series Board-to-Board Connectors

Phoenix Contact FR 1,27 Series Board-to-Board Connectors are high-speed connectors that enable data transmission at up to 28Gbps with intelligent component architecture and quality-driven manufacturing. These 1.27mm pitch connectors use high-quality materials and contact surfaces like gold-plated contact points to enable long-term stable signal transmission and currents up to 2.3A. The FR 1,27 connectors offer greater flexibility in component options through robust 6-position to 100-position board-to-board and wire-to-board connectors. The FR 1,27 series board-to-board connectors help to save time during the development process with customer-specific simulations for data integrity.